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Memory


  • PMC-CF: (from Dynamic Engineering)
    The PMC compatible PMC-CF design converts between the PMC Module bus and the IDE bus used for FLASH memory modules and other PC Card compatible designs. The PMC-CF acts as an adapter, converter, carrier, or bridge between the PMC bus and your PC Card hardware. The PMC-CF performs the conversion directly from the PCI bus - no external interfaces or cabling are required and speed is enhanced.

  • 2758 -- Non-Volatile RAM (2 MB): (from Technobox, Inc.)
    Up to 8 MB of auxiliary battery-protected SRAM storage (default configuration is 2 MB). Special build; production quantities.

  • 4128 -- Non-volatile RAM (8 MB): (from Technobox, Inc.)
    Auxiliary battery-protected SRAM storage. Standard configuration.

  • MM-6165D 2GB or 4GB 64-bit/66MHz PMC SDRAM Memory: (from Curtiss-Wright Controls, Inc.)
    The MM-6165D controller has a rev. 2.3 compliant PCI interface and operates in both 64-bit and 32-bit PCI modes at 33MHz or 66MHz and is capable of burst mode accesses at the full bus bandwidth at 66MHz. The peak transfer rate is 533MB/s. In addition to handling data management, the controller corrects single bit errors and provides double bit detection.

    The DMA has been optimized for multi-threaded operating systems and cluster implementations. Instead of just generating an interrupt after a transfer, the DMA writes a semaphore to the host in host memory when the transfer is complete so the host does not have to pole the status of the DMA. The array utilizes SDRAM devices of differing densities to provide up to 4GB of memory.

  • PBOD PMC Solid State Flash Drive: (from Curtiss-Wright Controls, Inc.)
    The PBOD is a solid state hard drive implemented as a PMC card with just a Bunch Of USB flash Drives. The PBOD supports industry standard ECC NAND Flash correction as well as wear leveling on card. No additional external software drivers are needed. Wear leveling is extremely important in solid state drives as it increases the life time of the NAND devices. NAND Flash devices are limited in the number of program/erase cycles that it can endure, typically, 100,000 cycles. The wear leveling algorithm spreads program/erase cycles evenly across the media. This avoids premature device failure due to frequent erase cycles on the same block of Flash memory.

    The PBOD is supported natively by operating systems that support USB Flash drives. This includes VxWorks® and Windows™.

  • PMC-550 Rugged Solid State Drive: (from Curtiss-Wright Controls, Inc.)
    The 550 is a rugged high performance NAND Flash solid state drive, available in an XMC (VITA42.3) or a PMC (IEEE1386.1) form factor. The 550 is visible as two independent SATA drives providing up to 32 GBytes of disk space. Available configurations come in 8, or 32 GBytes.

    Through multi-tasking technology, the 550 offers transfer rates of up to 30 Mbytes/sec for simultaneous read to each drive. For maximum throughput, RAID 0 is supported through software to stripe data across the two SATA drives.

  • PMC-FLASH-64: (from General Standards Corporation)
    Flash, NV SRAM, up to 64MB Flash, 512KB non-volatile SRAM (10 year)

  • PMC-FLASH-8: (from General Standards Corporation)
    8 Mbyte FLASH and Battery-Backed SRAM memory

  • PMC550-A: (from GE Fanuc)
    Modular Intelligent Memory, 16MB DRAM

  • PMC550-B: (from GE Fanuc)
    Modular Intelligent Memory, 32MB DRAM

  • PMC550-C: (from GE Fanuc)
    Modular Intelligent Memory, 64MB DRAM

  • PMC551-A: (from GE Fanuc)
    Modular Intelligent Memory, 64MB DRAM

  • PMC551-B: (from GE Fanuc)
    Modular Intelligent Memory, 128MB DRAM

  • PMC551-C: (from GE Fanuc)
    Modular Intelligent Memory, 256MB DRAM

  • PMC555-A: (from GE Fanuc)
    Modular Intelligent Memory, 8MB SRAM, battery-backed

  • PMC555-AA: (from GE Fanuc)
    Modular Intelligent Memory, 4MB SRAM, battery-backed

  • PMC555-AAA: (from GE Fanuc)
    Modular Intelligent Memory, 2MB SRAM, battery-backed

  • PMC555-B: (from GE Fanuc)
    Modular Intelligent Memory, 16MB SRAM, battery-backed

  • PMC555-C: (from GE Fanuc)
    Modular Intelligent Memory, 32MB SRAM, battery-backed

  • PMC557-A: (from GE Fanuc)
    Intelligent Memory Module, i960 co-processor, 16MB Flash

  • PMC557-B: (from GE Fanuc)
    Intelligent Memory Module, i960 co-processor, 32MB Flash

  • PMC557-C: (from GE Fanuc)
    Intelligent Memory Module, i960 co-processor, 64MB Flash

  • PMC557-D: (from GE Fanuc)
    Intelligent Memory Module, i960 co-processor, 128MB Flash

  • PMC557-E: (from GE Fanuc)
    Intelligent Memory Module, i960 co-processor, 256MB Flash

  • TPMC917-10: (from TEWS TECHNOLGIES GmbH)
    4MB SRAM (512K x 32 bit); Battery Backup by on board Lithium cell or external battery via P14; Battery monitor with interrupt on battery low; Additional 4 channel RS232 serial interface; Programmable baud rates up to 115.2 Kbaud; Support of Rx, Tx, RTS, CTS and GND per channel; 64 byte receive FIFO and 64 byte transmit FIFO per channel, programmable trigger levels for FIFO's; ESD protected RS232 line driver/receiver up to 15KV according to IEC1000-4-2; DB-25 female connector mounted in front panel; Operating temperature 0°C to +70°C

  • TPMC917-20: (from TEWS TECHNOLGIES GmbH)
    4MB SRAM (512K x 32 bit); Battery Backup by onboard Lithium cell or external battery via P14; Battery monitor with interrupt on battery low; Operating temperature 0°C to +70°C

  • VMS1 CompactFlash PMC module: (from Varisys)
    The VMS1 is an IEEE P1386.1 compliant PMC module that allows one or two standard CompactFlash memory cards to be used to build a compact and robust mass storage solution for embedded systems. With 16GB cards now shipping, the VMS1 is able to support up to 32GB storage capacity, with a roadmap to even higher capacities in the future. Dual CompactFlash card support on the VMS1 also allows software RAID to provide either striping for high capacity and performance (level 0) or mirroring for enhanced reliability (level 1). VMS1 ruggedization options are available to support industrial, airborne and military applications, including industrial temperature operation, conduction cooling and conformal coating.